Number of views: 2660 Author: Aili Industry Release time: 2027-01-30 Source: Ai Li Industrial
How to choose thin film deposition equipment EFU? You cannot choose an EFU first and then plug it into the equipment. There are vacuum chambers, gas pipelines and heating components inside the thin film deposition equipment. The space is compact and there is a lot of process exhaust. The installation position, air supply direction and control method of the EFU must be reversed from the wafer transfer area and cavity opening. First define the wafer path and key areas that need to be protected, and then combine the available space inside the equipment, the process exhaust direction and the control interface to determine where to install the EFU, how many units to install, and how to link them. Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and complete machine assembly. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system. There is no need to transfer parameters back and forth between the fan factory, filter factory and controller factory. This is why many thin film deposition equipment manufacturers will refer to the Aili Industrial equipment end plan description when selecting EFU.
The internal space of thin film deposition equipment is compact, and the installation location of the EFU must first meet the net size requirements. The available length, width and height, installation path, air inlet clearance and removal direction should be confirmed before selection. There are heating components, gas pipelines and vacuum chambers inside the equipment. The EFU installation location must be away from heat sources and pipelines to prevent the EFU from inhaling high-temperature gas or interfering with the pipelines. It only gives an available height and does not indicate the location of the heat source and pipes. The EFU may not fit in or be used properly.
spatial term |
What should be confirmed |
FAQ |
|---|---|---|
Available net dimensions |
Length, width, height and installation path |
Only give dimensions in one direction |
Avoid heat sources |
Distance from heating element |
Inhalation of hot gas |
Pipeline avoidance |
Distance from gas pipeline |
Interference with pipelines |
Change direction |
Disassembly and assembly directions of filter and fan |
Cannot be maintained after installation |
Ai Li industrialEFU products and customized configurations list the overall dimensions and installation interfaces by model. When checking the installation space, the thin film deposition equipment manufacturer can directly correspond to the specific model, and compare the internal net dimensions, heat source and pipeline location of the equipment with the unit appearance on the same picture. For projects with compact space, please refer to70mm ultra-thin EFU page.Compact model description in the
The focus of cleaning protection for thin film deposition equipment is around the wafer transfer area and the cavity opening. The air supply direction, coverage area, and air outflow inlet of the EFU must correspond to the wafer path and cavity opening. First mark the wafer area that needs to be protected, the source of particle risk and the allowed air flow direction, and then determine the location and number of EFUs. The airflow boundary is unclear, and no matter how large the air volume is, it may not be able to protect key locations. If there is a process exhaust or vacuum pump interface inside the equipment, it is also necessary to determine whether the exhaust direction conflicts with the EFU air supply.
airflow term |
What should be confirmed |
FAQ |
|---|---|---|
protected area |
Wafer path and cavity opening |
Unmarked key areas |
Air supply direction |
Correspondence to wafer path |
Air supply deviates from target |
flow boundary |
Process exhaust and vacuum pump interface |
Conflict between exhaust air and supply air |
Return air path |
How airflow is circulated or exhausted |
Return air is blocked |
For the relationship between airflow boundary and protection effect, please refer toWhy does the same air volume produce different cleaning and protection effects? In the description, the air supply direction, boundary conditions and wind speed distribution are evaluated together. Thin film deposition is a device-side application, please refer toHow to configure the semiconductor front-end equipment EFU? the key points of clean area, air volume filtration and equipment interface .Area division ideas in
The air volume and filtration level of the thin film deposition equipment EFU must be matched according to the needs of the wafer transfer area and cavity opening. The target air volume is determined by the protected area size and allowable wind speed, and the filtration level is determined by the particle control requirements. As the filtration level increases, the resistance increases and the fan operating point deviates, the air volume of the entire machine needs to be rechecked. The equipment space is compact, the filtration area is limited, and the surface wind speed and resistance may be higher than conventional models. When selecting, check based on the test data of the entire machine, not just the filter sample value.
Configuration items |
What should be confirmed |
Impact on selection |
|---|---|---|
Target air volume |
The required air supply volume of the protected area |
Determine EFU quantity and model |
filter level |
Particle control requirements |
Influence resistance and fan selection |
Effective filter area |
Filter area in a compact space |
Wind speed increases on area-restricted surface |
Noise and temperature rise |
Equipment restrictions on noise and temperature rise |
Affects fan operating point |
For the calculation method of air volume and surface wind speed, please refer toHow to calculate EFU rated air volume? Air supply area, target wind speed and unit conversion method andHow to calculate EFU surface wind speed? how to determine the effective filtration area and average wind speed . The calculation steps in Filter packages can be viewedthe HEPA vs. ULPA air filters page.Rating descriptions on
The thin film deposition process will produce process exhaust and by-products, and the EFU air supply and process exhaust must be coordinated. If the EFU air supply direction is directly opposite the exhaust port, clean air may be taken away directly by the exhaust air and cannot cover the protected area; if the exhaust air direction is directly opposite the EFU air inlet, the EFU may inhale air containing particles or by-products. When configuring, confirm the location, exhaust direction and exhaust volume of the air outlet, and then determine the EFU air supply direction and air inlet source to avoid interference between the two.
Exhaust item |
What should be confirmed |
Impact on EFU configuration |
|---|---|---|
Exhaust outlet location |
Relative position to EFU air supply and air inlet |
Affects air supply coverage and air intake quality |
Exhaust direction |
Relationship between airflow direction and EFU airflow |
avoid interfering with each other |
Exhaust air volume |
Ratio to EFU air supply volume |
Affects the internal pressure balance of the equipment |
process by-products |
particles and sediments |
Affect filter selection |
Regarding the method of coordinating process exhaust and EFU air supply, please refer toHow to configure the etching equipment EFU? how to coordinate clean air supply, process exhaust and corrosive environment .Coordination ideas on
Thin film deposition equipment EFU usually needs to be linked with the equipment status. During each stage of equipment standby, deposition, and maintenance, the EFU operating gear may be different. The control interface must have clear protocols, terminals, addresses and feedback methods to ensure that the EFU can switch with the device status instead of always running at full speed or shutting down all the time. The internal space of the equipment is compact, and control cable routing and terminal accessibility must also be confirmed during the selection stage.
Controls |
What should be confirmed |
FAQ |
|---|---|---|
Running gear |
Standby, deposition, maintenance gears |
Only one fixed gear is set |
control interface |
Protocol, terminal, address |
Not compatible with device controller |
status feedback |
Operation, alarm and fault signals |
The device cannot read the status |
Exception handling |
Disconnection, power outage, over-temperature action |
No protection logic when exception occurs |
For projects involving multi-speed speed regulation, please refer toHow to set EFU multi-speed speed adjustment? equipment linkage, abnormal status and acceptance points . Gear division and linkage logic in For projects that require DC speed regulation solutions, please refer tothe DC speed regulating EFU equipment fan filter unit page.Control instructions on
There are heating components inside the thin film deposition equipment, and the ambient temperature may be higher than that of general equipment. The EFU's motor and driver operate in a high-temperature environment, and the temperature rise may be higher. When selecting, confirm the internal ambient temperature of the equipment and the temperature rise data of the EFU under target operating conditions, as well as whether the box has sufficient heat dissipation conditions. If the ambient temperature is high and the heat dissipation conditions are poor, the EFU temperature will rise, which may affect the lifespan and stability.
Temperature rise term |
What should be confirmed |
FAQ |
|---|---|---|
ambient temperature |
Equipment internal operating temperature |
High temperature environment temperature rise rises |
Motor temperature rise |
Temperature rise record under target operating conditions |
Only normal temperature data is given |
Heat dissipation conditions |
Box heat dissipation structure and ventilation |
The box is closed and has no heat dissipation |
protection logic |
Protection action when over-temperature occurs |
No temperature protection |
Regarding the method of judging the temperature rise of the motor, please refer toHow to judge the temperature rise of EFU motor? measurement conditions, load, heat dissipation and limit value confirmation . Checking methods for For heat dissipation check methods of ultra-thin models, please refer toHow to choose ultra-thin EFU? Space, Air Volume Static Pressure, Heat Dissipation and Maintenance Points .Instructions in
Thin film deposition equipment EFU is a compact structure on the equipment side. New structure or new interface projects should be prototyped or first verified first. The prototype must check assembly interference, air volume, static pressure, power, temperature rise, vibration, noise and communication logic to confirm that the performance does not deviate from the target under the internal conditions of the equipment. The prototype data and confirmation drawings are archived together as the basis for inspection of subsequent batches.
Verification items |
What should be recorded |
What it means for batch size |
|---|---|---|
Assembly inspection |
Hole location, sealing, heat source and pipeline avoidance |
Confirm that the structure can be assembled |
Performance testing |
Air volume, static pressure, power, noise |
Confirm that the work point meets the standards |
Temperature rise and vibration |
Temperature rise and vibration in high temperature environment |
Confirm long-term stable operation |
Communication test |
Protocol, address, alarm feedback |
Confirm that the interface is available |
In the thin film deposition equipment EFU project, Aili Industries organizes the prototype or first unit verification according to the equipment drawings, files the assembly, performance, temperature rise, vibration and communication data together with the confirmation drawings, and then solidifies the batch configuration. Equipment factories complete prototypes and batches within the same manufacturing system, making it easier to maintain version consistency than cross-supplier coordination. Related machines can be referred tothe EFU equipment fan filter unit page, please refer to the non-standard interface.For the structural description on Customize EFU page.Customization instructions in the
Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and self-developed controls. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system, without the need to transfer parameters between multiple suppliers. For equipment-side compact projects such as thin film deposition equipment, Aili Industrial can organize prototype verification and batch curing according to the confirmation drawing, and reduce the installation dimensions, air supply direction, control interfaces and maintenance paths to verifiable complete machine data. Related machines can be referred tothe EFU Equipment Fan Filter Unit page.Instructions on
First complete the preliminary screening of information, and then conduct technical confirmation on the model to be purchased. Include installation space, air flow organization, air volume filtration, process exhaust, control linkage, temperature rise and heat dissipation, and prototype verification in the supplementary list. Comparison will be organized after the supplier responds. The confirmed EFU model, configuration and interface are used for order execution, and sample parameters cannot be used to replace this project data. Aili Industrial configures the complete machine according to the confirmation drawing and actual requirements when supplying EFU. Fans, filters, cabinets and controls correspond to each item in the order list, which facilitates the thin film deposition equipment manufacturer to select EFU based on verifiable complete machine conditions.
It should be avoided to select EFU first and then find the installation location. It should be avoided to only estimate the air volume based on the appearance of the equipment without delineating the protection area. It should be avoided to ignore heat sources and pipeline avoidance. It should be avoided to ignore the interference of process exhaust air on EFU air supply. It should be avoided to ignore the impact of high temperature environment on temperature rise. It should be avoided to confirm the compatibility of the control interface only after installation. The core of EFU selection of thin film deposition equipment is not to choose a unit with beautiful parameters, but to form a verifiable closed loop of installation space, air flow organization, control linkage, process exhaust and temperature rise and heat dissipation. Aili Industrial can first form a to-be-confirmed list based on the equipment drawings, listing the space, airflow and temperature rise conditions together.
It should not be applied directly. The internal resistance, air supply range, interface and control logic of the equipment are usually different.
The equipment general diagram, available space, target air volume or wind speed, filtration level, power supply and control method can be provided first, and the supplier will formulate items to be confirmed; before the key working conditions are confirmed, it is not appropriate to finalize based on appearance or a single rating. Aili Industrial can first form a to-be-confirmed list based on the equipment drawings, listing the space, airflow and temperature rise conditions together.
Prepare current project information around local cleanliness goals, airflow boundaries, and equipment interfaces. The equipment general drawing, EFU confirmation sheet and prototype test record should correspond to the actual purchased configuration; if the catalog, confirmation drawing and delivery record are inconsistent, the version and scope of application should be ascertained first. When selecting thin film deposition equipment EFU, you can refer to the complete machine and control supporting instructions provided by Aili Industry by model.
Related articles
Check items |
Confirm key points |
|---|---|
Installation space |
Net size, heat source and pipeline avoidance, removal direction |
airflow organization |
Wafer paths, cavity openings, airflow boundaries |
Air volume filter |
Match according to regional needs and check face wind speed |
Process exhaust |
Coordinate air supply and exhaust directions |
Temperature rise and heat dissipation |
Temperature rise and heat dissipation conditions in high-temperature environments |
Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and self-developed controls. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system, without the need to transfer parameters between multiple suppliers. Equipment factories complete prototypes and batches of thin film deposition equipment EFU within the same system, which is easier to maintain consistency than cross-supplier coordination.
learnAili Industrial EFU products and customized configurations , the complete machine structure can be viewedEFU equipment fan filter unit , compact models can be viewed70mm ultra-thin EFU , non-standard interface can be viewedCustomized EFU , control scheme can be viewedDC speed regulating EFU equipment fan filter unit , filter package can be viewedHEPA and ULPA air filters . Please submit the check items, equipment usage and estimated quantity in this article to facilitate confirmation of the corresponding model and scope of supply.