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How to choose thin film deposition equipment EFU? Installation space, airflow organization and control linkage method

Number of views: 2660     Author: Aili Industry Release time: 2027-01-30 Source: Ai Li Industrial

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How to choose thin film deposition equipment EFU? Installation space, airflow organization and control linkage method

How to choose thin film deposition equipment EFU? You cannot choose an EFU first and then plug it into the equipment. There are vacuum chambers, gas pipelines and heating components inside the thin film deposition equipment. The space is compact and there is a lot of process exhaust. The installation position, air supply direction and control method of the EFU must be reversed from the wafer transfer area and cavity opening. First define the wafer path and key areas that need to be protected, and then combine the available space inside the equipment, the process exhaust direction and the control interface to determine where to install the EFU, how many units to install, and how to link them. Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and complete machine assembly. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system. There is no need to transfer parameters back and forth between the fan factory, filter factory and controller factory. This is why many thin film deposition equipment manufacturers will refer to the Aili Industrial equipment end plan description when selecting EFU.

Installation space: measure the net size first, then look at the heat source and pipelines

The internal space of thin film deposition equipment is compact, and the installation location of the EFU must first meet the net size requirements. The available length, width and height, installation path, air inlet clearance and removal direction should be confirmed before selection. There are heating components, gas pipelines and vacuum chambers inside the equipment. The EFU installation location must be away from heat sources and pipelines to prevent the EFU from inhaling high-temperature gas or interfering with the pipelines. It only gives an available height and does not indicate the location of the heat source and pipes. The EFU may not fit in or be used properly.

spatial term

What should be confirmed

FAQ

Available net dimensions

Length, width, height and installation path

Only give dimensions in one direction

Avoid heat sources

Distance from heating element

Inhalation of hot gas

Pipeline avoidance

Distance from gas pipeline

Interference with pipelines

Change direction

Disassembly and assembly directions of filter and fan

Cannot be maintained after installation

Ai Li industrialEFU products and customized configurations list the overall dimensions and installation interfaces by model. When checking the installation space, the thin film deposition equipment manufacturer can directly correspond to the specific model, and compare the internal net dimensions, heat source and pipeline location of the equipment with the unit appearance on the same picture. For projects with compact space, please refer to70mm ultra-thin EFU page.Compact model description in the

Airflow organization: wafer paths and cavity openings must be demarcated first

The focus of cleaning protection for thin film deposition equipment is around the wafer transfer area and the cavity opening. The air supply direction, coverage area, and air outflow inlet of the EFU must correspond to the wafer path and cavity opening. First mark the wafer area that needs to be protected, the source of particle risk and the allowed air flow direction, and then determine the location and number of EFUs. The airflow boundary is unclear, and no matter how large the air volume is, it may not be able to protect key locations. If there is a process exhaust or vacuum pump interface inside the equipment, it is also necessary to determine whether the exhaust direction conflicts with the EFU air supply.

airflow term

What should be confirmed

FAQ

protected area

Wafer path and cavity opening

Unmarked key areas

Air supply direction

Correspondence to wafer path

Air supply deviates from target

flow boundary

Process exhaust and vacuum pump interface

Conflict between exhaust air and supply air

Return air path

How airflow is circulated or exhausted

Return air is blocked

For the relationship between airflow boundary and protection effect, please refer toWhy does the same air volume produce different cleaning and protection effects? In the description, the air supply direction, boundary conditions and wind speed distribution are evaluated together. Thin film deposition is a device-side application, please refer toHow to configure the semiconductor front-end equipment EFU? the key points of clean area, air volume filtration and equipment interface .Area division ideas in

Air volume and filtration: matched according to wafer area requirements

The air volume and filtration level of the thin film deposition equipment EFU must be matched according to the needs of the wafer transfer area and cavity opening. The target air volume is determined by the protected area size and allowable wind speed, and the filtration level is determined by the particle control requirements. As the filtration level increases, the resistance increases and the fan operating point deviates, the air volume of the entire machine needs to be rechecked. The equipment space is compact, the filtration area is limited, and the surface wind speed and resistance may be higher than conventional models. When selecting, check based on the test data of the entire machine, not just the filter sample value.

Configuration items

What should be confirmed

Impact on selection

Target air volume

The required air supply volume of the protected area

Determine EFU quantity and model

filter level

Particle control requirements

Influence resistance and fan selection

Effective filter area

Filter area in a compact space

Wind speed increases on area-restricted surface

Noise and temperature rise

Equipment restrictions on noise and temperature rise

Affects fan operating point

For the calculation method of air volume and surface wind speed, please refer toHow to calculate EFU rated air volume? Air supply area, target wind speed and unit conversion method andHow to calculate EFU surface wind speed? how to determine the effective filtration area and average wind speed . The calculation steps in Filter packages can be viewedthe HEPA vs. ULPA air filters page.Rating descriptions on

Process exhaust coordination: air supply and exhaust cannot interfere with each other

The thin film deposition process will produce process exhaust and by-products, and the EFU air supply and process exhaust must be coordinated. If the EFU air supply direction is directly opposite the exhaust port, clean air may be taken away directly by the exhaust air and cannot cover the protected area; if the exhaust air direction is directly opposite the EFU air inlet, the EFU may inhale air containing particles or by-products. When configuring, confirm the location, exhaust direction and exhaust volume of the air outlet, and then determine the EFU air supply direction and air inlet source to avoid interference between the two.

Exhaust item

What should be confirmed

Impact on EFU configuration

Exhaust outlet location

Relative position to EFU air supply and air inlet

Affects air supply coverage and air intake quality

Exhaust direction

Relationship between airflow direction and EFU airflow

avoid interfering with each other

Exhaust air volume

Ratio to EFU air supply volume

Affects the internal pressure balance of the equipment

process by-products

particles and sediments

Affect filter selection

Regarding the method of coordinating process exhaust and EFU air supply, please refer toHow to configure the etching equipment EFU? how to coordinate clean air supply, process exhaust and corrosive environment .Coordination ideas on

Control linkage: synchronized with the operating status of thin film deposition equipment

Thin film deposition equipment EFU usually needs to be linked with the equipment status. During each stage of equipment standby, deposition, and maintenance, the EFU operating gear may be different. The control interface must have clear protocols, terminals, addresses and feedback methods to ensure that the EFU can switch with the device status instead of always running at full speed or shutting down all the time. The internal space of the equipment is compact, and control cable routing and terminal accessibility must also be confirmed during the selection stage.

Controls

What should be confirmed

FAQ

Running gear

Standby, deposition, maintenance gears

Only one fixed gear is set

control interface

Protocol, terminal, address

Not compatible with device controller

status feedback

Operation, alarm and fault signals

The device cannot read the status

Exception handling

Disconnection, power outage, over-temperature action

No protection logic when exception occurs

For projects involving multi-speed speed regulation, please refer toHow to set EFU multi-speed speed adjustment? equipment linkage, abnormal status and acceptance points . Gear division and linkage logic in For projects that require DC speed regulation solutions, please refer tothe DC speed regulating EFU equipment fan filter unit page.Control instructions on

Temperature rise and heat dissipation: The heat source of deposition equipment affects EFU

There are heating components inside the thin film deposition equipment, and the ambient temperature may be higher than that of general equipment. The EFU's motor and driver operate in a high-temperature environment, and the temperature rise may be higher. When selecting, confirm the internal ambient temperature of the equipment and the temperature rise data of the EFU under target operating conditions, as well as whether the box has sufficient heat dissipation conditions. If the ambient temperature is high and the heat dissipation conditions are poor, the EFU temperature will rise, which may affect the lifespan and stability.

Temperature rise term

What should be confirmed

FAQ

ambient temperature

Equipment internal operating temperature

High temperature environment temperature rise rises

Motor temperature rise

Temperature rise record under target operating conditions

Only normal temperature data is given

Heat dissipation conditions

Box heat dissipation structure and ventilation

The box is closed and has no heat dissipation

protection logic

Protection action when over-temperature occurs

No temperature protection

Regarding the method of judging the temperature rise of the motor, please refer toHow to judge the temperature rise of EFU motor? measurement conditions, load, heat dissipation and limit value confirmation . Checking methods for For heat dissipation check methods of ultra-thin models, please refer toHow to choose ultra-thin EFU? Space, Air Volume Static Pressure, Heat Dissipation and Maintenance Points .Instructions in

Prototype verification: Thin film deposition equipment projects must be tested first before batch production

Thin film deposition equipment EFU is a compact structure on the equipment side. New structure or new interface projects should be prototyped or first verified first. The prototype must check assembly interference, air volume, static pressure, power, temperature rise, vibration, noise and communication logic to confirm that the performance does not deviate from the target under the internal conditions of the equipment. The prototype data and confirmation drawings are archived together as the basis for inspection of subsequent batches.

Verification items

What should be recorded

What it means for batch size

Assembly inspection

Hole location, sealing, heat source and pipeline avoidance

Confirm that the structure can be assembled

Performance testing

Air volume, static pressure, power, noise

Confirm that the work point meets the standards

Temperature rise and vibration

Temperature rise and vibration in high temperature environment

Confirm long-term stable operation

Communication test

Protocol, address, alarm feedback

Confirm that the interface is available

In the thin film deposition equipment EFU project, Aili Industries organizes the prototype or first unit verification according to the equipment drawings, files the assembly, performance, temperature rise, vibration and communication data together with the confirmation drawings, and then solidifies the batch configuration. Equipment factories complete prototypes and batches within the same manufacturing system, making it easier to maintain version consistency than cross-supplier coordination. Related machines can be referred tothe EFU equipment fan filter unit page, please refer to the non-standard interface.For the structural description on Customize EFU page.Customization instructions in the

Aili Industrial's thin film deposition equipment EFU solution

Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and self-developed controls. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system, without the need to transfer parameters between multiple suppliers. For equipment-side compact projects such as thin film deposition equipment, Aili Industrial can organize prototype verification and batch curing according to the confirmation drawing, and reduce the installation dimensions, air supply direction, control interfaces and maintenance paths to verifiable complete machine data. Related machines can be referred tothe EFU Equipment Fan Filter Unit page.Instructions on

How to form executable confirmation results

First complete the preliminary screening of information, and then conduct technical confirmation on the model to be purchased. Include installation space, air flow organization, air volume filtration, process exhaust, control linkage, temperature rise and heat dissipation, and prototype verification in the supplementary list. Comparison will be organized after the supplier responds. The confirmed EFU model, configuration and interface are used for order execution, and sample parameters cannot be used to replace this project data. Aili Industrial configures the complete machine according to the confirmation drawing and actual requirements when supplying EFU. Fans, filters, cabinets and controls correspond to each item in the order list, which facilitates the thin film deposition equipment manufacturer to select EFU based on verifiable complete machine conditions.

Misunderstandings to avoid

It should be avoided to select EFU first and then find the installation location. It should be avoided to only estimate the air volume based on the appearance of the equipment without delineating the protection area. It should be avoided to ignore heat sources and pipeline avoidance. It should be avoided to ignore the interference of process exhaust air on EFU air supply. It should be avoided to ignore the impact of high temperature environment on temperature rise. It should be avoided to confirm the compatibility of the control interface only after installation. The core of EFU selection of thin film deposition equipment is not to choose a unit with beautiful parameters, but to form a verifiable closed loop of installation space, air flow organization, control linkage, process exhaust and temperature rise and heat dissipation. Aili Industrial can first form a to-be-confirmed list based on the equipment drawings, listing the space, airflow and temperature rise conditions together.

Related questions and answers

Can the equipment-side EFU directly apply cleanroom FFU parameters?

It should not be applied directly. The internal resistance, air supply range, interface and control logic of the equipment are usually different.

How to promote EFU selection of thin film deposition equipment when the project information is incomplete?

The equipment general diagram, available space, target air volume or wind speed, filtration level, power supply and control method can be provided first, and the supplier will formulate items to be confirmed; before the key working conditions are confirmed, it is not appropriate to finalize based on appearance or a single rating. Aili Industrial can first form a to-be-confirmed list based on the equipment drawings, listing the space, airflow and temperature rise conditions together.

What specific information do I need to prepare for this question?

Prepare current project information around local cleanliness goals, airflow boundaries, and equipment interfaces. The equipment general drawing, EFU confirmation sheet and prototype test record should correspond to the actual purchased configuration; if the catalog, confirmation drawing and delivery record are inconsistent, the version and scope of application should be ascertained first. When selecting thin film deposition equipment EFU, you can refer to the complete machine and control supporting instructions provided by Aili Industry by model.

Related articles

How to configure the semiconductor front-end equipment EFU? Key points of clean area, air volume filtration and equipment interface

How to configure the etching equipment EFU? How to coordinate clean air supply, process exhaust and corrosive environment

How to confirm the EFU installation location? Equipment drawings, installation conditions and acceptance methods

Key points for selection and acceptance inspection

Check items

Confirm key points

Installation space

Net size, heat source and pipeline avoidance, removal direction

airflow organization

Wafer paths, cavity openings, airflow boundaries

Air volume filter

Match according to regional needs and check face wind speed

Process exhaust

Coordinate air supply and exhaust directions

Temperature rise and heat dissipation

Temperature rise and heat dissipation conditions in high-temperature environments

Aili Industrial EFU selection and procurement support

Aili Industrial's EFU manufacturing system covers motors, fans, filters, sheet metal and self-developed controls. The installation space, airflow organization and control linkage of the thin film deposition equipment EFU can be checked according to the equipment drawings within the same manufacturing system, without the need to transfer parameters between multiple suppliers. Equipment factories complete prototypes and batches of thin film deposition equipment EFU within the same system, which is easier to maintain consistency than cross-supplier coordination.

learnAili Industrial EFU products and customized configurations , the complete machine structure can be viewedEFU equipment fan filter unit , compact models can be viewed70mm ultra-thin EFU , non-standard interface can be viewedCustomized EFU , control scheme can be viewedDC speed regulating EFU equipment fan filter unit , filter package can be viewedHEPA and ULPA air filters . Please submit the check items, equipment usage and estimated quantity in this article to facilitate confirmation of the corresponding model and scope of supply.

Aili Industrial develops and manufactures FFU, EFU, HEPA/ULPA air filters, high-efficiency air supply vents, fan boxes and other clean air equipment. Relying on motors, fans, control systems, filters and complete machine supporting capabilities, we provide selection and customization support for clean room and production equipment projects.

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