Number of views: 5429 Author: Aili Industry Release time: 2027-09-15 Source: Ai Li Industrial
Whether the wet process area and the photolithography area can share chemical filtration configurations requires comparison of specific gases, pollution forms, and protection objectives. Even if the space is adjacent, the acid mist, gas and sensitive components in the two areas may be different, and the same filter material cannot be directly copied. Adjacent does not mean identical. Before sharing configurations, you must first check the differences between the two sides.
Acid mist, alkaline solution volatiles and droplet entrainment are common in the wet process area, and droplets account for a certain proportion of pollution forms; the photolithography area pays more attention to alkaline gas, organic components and specific molecular pollution, and is often more sensitive to concentration. The target gas lists, concentration levels and allowable outlet limits of the two zones are different. If the same set of media configuration is used to cover them, it is easy to have a surplus on one side but not enough on the other. The first step in the shared configuration is to list the key gases and protection requirements of the two areas separately, and then see which parts can be combined and which must be separated.
The droplet load around the wet area is a factor that usually does not need to be considered in the configuration of the lithography area. The entry of droplets into the chemical filter section will change the media state and resistance. Water blocking, defogging or local exhaust measures may be required near the wet process area, while the photolithography area pays more attention to gas composition and clean compatibility. If two zones share a filtering structure, it becomes a question that needs to be clarified as to which zone the front-end protection is designed according to. If designed according to the conditions of the wet process area, the photolithography area may feel structurally redundant; if designed according to the conditions of the photolithography area, the risk of droplets in the wet process area may be underestimated.
If the two areas share a return air system, acid mist or volatile components from the wet process area may enter the photolithography area with the return air, causing cross-area pollution. In this case, the filtration configuration not only treats the air in the respective zone, but also takes into account the mixed gas load and interaction. The shared system needs to set up corresponding filtering measures in the mixed section or branch section, and verify the protection positions of the two zones respectively. If the risk of cross-zone transmission is high, separate partitions may be more controllable than pooling. For ideas on prevention and control of cross-regional pollution, please refer toHow should gaseous contamination be prevented from crossing into the wafer transfer area?。
Even if the two areas share a filtration system, their respective key locations should be tested separately during acceptance. The wet method area focuses on acidity and droplet-related indicators, while the photolithography area focuses on alkaline and organic components. The detection methods and points on both sides are different. Just because the shared system meets the standards in one district does not mean that the other district also meets the standards. During verification, the working status and testing conditions of each zone should be recorded to avoid using the mixed average value to cover up problems in a single zone. Regarding the determination method of alkaline gas target, please refer toHow should the filtration target be determined when the photoresist is sensitive to alkaline gases?。
For projects that share filtration configurations between the wet process area and the photolithography area, we usually recommend that customers first list the gas lists, pollution forms, and protection requirements of the two areas separately, and then determine which parts can be combined and which need to be processed separately. Aili Industry can provide selection packages for box-type, flat-plate and V-type chemical filtration products. For box-type MAU packages, please refer toMAU box type chemical filter , product series can be viewedChemical filter product range . The V-shaped structure provides a larger filtration area in the same box space, and helps control surface speed and total resistance when configured in multiple layers. Device-side applications can useChemical filter FFU type, integrated chemical adsorption layer withHEPA/ULPA filter particle filtration, and the zoned circulation section can be configured separately according to the target gas in each zone. The manufacturing end covers independent R&D and production of motors and fans, control systems, sheet metal and complete machine assembly. The partitioned air paths, filter section positions and resistance distribution can be checked in the same package, and non-standard structures can be adjusted according to on-site space. The specific gas effect, applicable environment and replacement cycle still need to be verified based on the corresponding configuration data and on-site working conditions. The actual results are subject to on-site leak detection and gas detection results.
If the two areas are adjacent to each other, can they share a set of chemical filtration sections?
It is necessary to first compare the gas lists, pollution patterns and protection targets of the two regions. If the differences are large or there is a risk of cross-district transmission, partitioning may be more controllable.
When the return air is shared, will the acid mist in the wet process area affect the photolithography area?
This possibility exists. The mixed gas load and mutual influence need to be checked during the design of the shared system, and the protection positions of the two zones must be verified separately.
Can Aili Industrial assist with zone filtering configuration?
The gas list, air path and installation space of the two zones can be combined to check the zoning or sharing plan and filter section configuration. The specific plan needs to be confirmed based on product data and on-site working conditions.
How should the filtration target be determined when the photoresist is sensitive to alkaline gases?
How should gaseous contamination be prevented from crossing into the wafer transfer area?
What sources of AMC should we pay attention to when supplying air around etching equipment?
What molecular contaminants need to be assessed for FOUP storage areas?
Check items |
Confirm key points |
Check items |
Confirm key points |
|---|---|---|---|
Regional requirements |
Define protection goals separately |
Pollution form |
Distinguish between gases and liquid droplets |
shared air |
Check for cross-region spread |
Verification arrangements |
Set detection indicators for each area |
Front-end structure |
Designed for higher risk conditions |
Maintenance method |
Confirm partition or shared responsibilities |